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1. LED ¶õ?
¢º Light Emitting DiodeÀÇ ¾àÀÚ·Î ¹ß±¤ ´ÙÀÌ¿Àµå¸¦ ¶æÇϸç ÀÌ´Â ÈÇÕ¹°¹ÝµµÃ¼ÀÇ Æ¯¼ºÀ» ÀÌ¿ëÇØ Àü±â ½ÅÈ£¸¦ Àû¿Ü¼± ¶Ç´Â ºûÀ¸·Î º¯È¯½ÃÄÑ ½ÅÈ£¸¦ º¸³»°í ¹Þ´Â µ¥ »ç¿ëµÇ´Â ¹ÝµµÃ¼ÀÇ ÀÏÁ¾À¸·Î °¡Á¤¿ë °¡ÀüÁ¦Ç°, ¸®¸ðÄÜ, Àü±¤ÆÇ, Ç¥½Ã±â, °¢Á¾ ÀÚµ¿È ±â±âµî¿¡ »ç¿ëµÈ´Ù. LED´Â Å©°Ô IRED(Infrared Emitting Diode)¿Í VLED(Visible Light Emitting Diode)·Î ³ª´µ¾î Áø´Ù.
¢º Infrared LED chip IRED(Infrared Emitting Diode) ChipÀ» ¶æÇÏ´Â °ÍÀÌ´Ù. ÀÌ Ä¨Àº °¡°øµÇ¾î IR Emitter, TV ¸®¸ðÄÁ, ±¤ÇнºÀ§Ä¡, IR LAN, ¹«¼± µðÁöÅÐ µ¥ÀÌÅÍ Åë½Å¿ë ¸ðµâµî¿¡ ¾²ÀδÙ.
¢º Visible LED chip VLED(Visible Light Emitting Diode) ChipÀ» ¶æÇÏ¸ç »¡°, ³ì»ö, ¿À·£Áö»ö µîÀÌ °³¹ßµÇ¾î ÀÖ´Ù. ÀÌ Ä¨Àº ·¥ÇÁ·Î Á¶¸³(LED)µÇ¾î °¢Á¾ ÀüÀÚÁ¦Ç°ÀÇ Ç¥½Ã³ª ½ÅÈ£µî ¹× Àü±¤ÆǵîÀÇ ±¤¿øÀ¸·Î ¾²ÀδÙ.
2. LED ºÎºÐº° ¸íĪ 1. Chip 2. Lead frame 3. Gold wire 4. Epoxy 5. Cathode 6. Anode |
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3. LED¿¡ »ç¿ëµÇ´Â ¹ÝµµÃ¼ ¢º General ±Þ
GaP |
GaN |
GaAs |
GaAlAs |
Green, Red |
Blue |
Red, Infrared |
Red, Infrared |
¢º Super ±Þ
GaAlAs |
GaAsP |
GaN |
InGaN |
GaP |
Red |
Red, Yellow |
Blue |
Green |
Green |
¢º Ultra ±Þ
GaAlAs |
InGaAlP |
GaN |
InGaN |
Red |
Yellow, Orange, Red |
Blue |
Green |
4. LED ÆÄÀ庰 »ö ¢º LED´Â ÈÖµµ¿¡ µû¶ó General±Þ, Super±Þ, Ultra±ÞÀ¸·Î ³ª´²Áø´Ù. 100mcd ÀÌÇÏ´Â General±ÞÀÌ°í, 500mcd ÀÌÇÏ´Â Super±Þ, ±× ÀÌ»óÀº Ultra±ÞÀÌ´Ù.
¢º General±Þ
400~450 |
450~470 |
470~557 |
557~567 |
567~572 |
572~585 |
585~605 |
605~630 |
630~700 |
Pure Blue |
General Blue |
Pure Green |
General Green |
Yellow Green |
General Yellow |
General Amber |
General Orange |
General Red |
¢º Super±Þ
470 |
572 |
650 |
660 |
Super Blue |
Super Yellow Green |
Super Red |
Super Red |
¢º Ultra
591 |
610 |
624 |
639 |
660 |
Ultra Yellow |
Ultra Amber |
Ultra Orange |
Ultra Red |
Ultra Red |
5. LED »ý»ê°øÁ¤
In-Line °øÁ¤ In-line°øÁ¤Àº die bonding °øÁ¤°ú wire bonding °øÁ¤À¸·Î ÀÌ·ç¾îÁø´Ù. ÀÌ µÎ °øÁ¤Àº ÀÚµ¿È»ó ÀνĽýºÅÛ¿¡ ÀÇÇØ ÀüÀÚµ¿À¸·Î ÀÌ·ç¾îÁø´Ù. Die bonding °øÁ¤Àº ĨÀ» lead frameÀÇ cup Áß¾Ó¿¡ ¹Ì¸® ¹ß¶óÁø silver epoxy À§¿¡ Àû´çÇÑ ¾Ð·ÂÀ¸·Î ´·¯ À§Ä¡½ÃÅ°´Â °ÍÀÌ Áß¿äÇϸç, wire bonding °øÁ¤Àº gold wire¸¦ ¹ÝµµÃ¼ Ĩ À§¸é Àü±Ø°ú ÇÑÂÊ lead frameÀ» Àû´çÇÑ ¾Ð·ÂÀ¸·Î Á¢Âø.¿¬°áÇÏ´Â °ÍÀÌ Áß¿äÇÏ´Ù. Mold °øÁ¤ Mold °øÁ¤Àº ĨÀÌ bondingµÈ lead frameÀ» epoxy·Î ½Î´Â °øÁ¤ÀÌ´Ù. ÀÚµ¿À¸·Î ÀÌÇüÁ¦°¡ »Ñ·ÁÁö°í epoxy°¡ ´ã°ÜÁø mold cup¿¡ lead frameÀ» ´ã±Ù ÈÄ Àü±â oven¿¡ ³Ö°í °æȽÃÄÑ LED ·¥ÇÁ¸¦ ¿Ï¼ºÇÑ´Ù. ÁÖ¿ä ºÒ·®À² ¿øÀÎÀÎ mold cup°ú lead frame°úÀÇ »ðÀÔ ³ôÀÌ, ¼öÆò À¯Áö, center À§Ä¡ µîÀÌ ÀÌ·ç¾îÁø´Ù. Test ¹× ºÐ·ù °øÁ¤ LED ·¥ÇÁÀÇ Àü±âÀû. ±¤ÇÐÀû Ư¼ºÀ» ÃøÁ¤ÇÏ¿© ±× ¼º´É¿¡ µû¶ó ºÐ·ùÇÏ´Â °øÁ¤ÀÌ´Ù. Tapping °øÁ¤ PCB ±âÆÇ¿¡ ÀüÀÚºÎÇ°À» ÀÚµ¿À¸·Î »ðÀÔ½ÃÄÑ ÁÖ´Â ÀÚµ¿»ðÀԱ⿡ ¾µ ¼ö ÀÖµµ·Ï LED ·¥ÇÁÀÇ ÇüŸ¦ ¸¸µé¾î ÁÖ°í (Forming)Tape¿¡ ºÙÀÌ´Â °øÁ¤ÀÌ´Ù.
6. LED »ê¾÷ Àü¸Á LED´Â ¹ÝµµÃ¼¶ó´Â Ư¼ºÀ¸·Î ÀÎÇØ Ã³¸®¼Óµµ, Àü·Â¼Ò¸ð, ¼ö¸í µîÀÇ Á¦¹Ý»çÇ׿¡¼ Å« ÀåÁ¡À» º¸¿© °¢Á¾ ÀüÀÚÁ¦Ç°ÀÇ ÀüÀÚÇ¥½ÃºÎÇ°À¸·Î °¢±¤¹Þ°í ÀÖ´Ù. ±×¸®°í ³ôÀº ÈÖµµÀÇ Á¦Ç°µéÀÌ »ý»êµÇ¸é¼ ¾ÕÀ¸·Î Á¶¸í±â±¸ÀÇ ¿ªÇÒµµ ´ëÄ¡ÇÒ ¼ö ÀÖÀ» °ÍÀÌ´Ù. ±âÁ¸ Àü±¸·¥ÇÁó·³ ´«ÀÌ ºÎ½Ã°Å³ª ¿¤·¯¸ÕÆ®°¡ ´Ü¶ôµÇ´Â °æ¿ì°¡ ¾ø´Â LED´Â ¼ÒÇüÀ¸·Î Á¦ÀÛµÇ¾î °¢Á¾ Ç¥½Ã¼ÒÀÚ·Î Æø³Ð°Ô »ç¿ëµÇ°í ÀÖÀ¸¸ç ¹Ý¿µ±¸ÀûÀÎ ¼ö¸í(¾à 1¹é¸¸½Ã°£)À¸·Î ±× È°¿ëµµ°¡ ³ô´Ù. ƯÈ÷ û»öLEDÀÇ »ó¿ëÈ·Î LEDÀÇ Ç®Ä÷¯ ±¸ÇöÀÌ °¡´ÉÇØÁö°í °¡°Ýµµ Å©°Ô ³·Ãâ ¼ö ÀÖ°Ô µÇ¸é¼ Á¦Ç°ÀÇ È°¿ëµµ´Â ±Þ¼ÓÈ÷ ³ô¾ÆÁú Àü¸ÁÀÌ´Ù.
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